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سالهفتهIDTitleApplNoIPCApplicantSubgroupزیر گروهرشته شرحDescription
202547WO/2025/129771WIRING SUBSTRATE AND PREPARATION METHOD THEREFOR, LIGHT-EMITTING SUBSTRATE, AND DISPLAY APPARATUSCN2024/071693H01L 23/498BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/188364OPTICALLY-INDUCED COOLINGUS2024/047985H01L 23/34THE REGENTS OF THE UNIVERSITY OF MICHIGANELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236124ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANELCN2024/092711H01L 27/12BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236272POSITION LIMITING DEVICE FOR TRANSISTOR, POSITION LIMITING MODULE, AND ASSEMBLY METHOD THEREFORCN2024/093854H01L 23/40DELTA ELECTRONICS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236422OPTICAL RECEIVER, OPTICAL RECEIVING MODULE, AND ELECTRONIC DEVICECN2024/109128H01L 25/16HARBIN HEG TECHNOLOGY DEVELOPMENT LTD., COELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236678CROSSTALK SHIELDING APPARATUS, CROSSTALK SHIELDING DEVICE AND INTELLIGENT TERMINAL DEVICECN2024/142374H01L 23/552GOERTEK MICROELECTRONICS INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236793ELECTROCHEMICAL TREATMENT DEVICE FOR NITRIDE SEMICONDUCTOR AND WAFER DOPING TREATMENT PROCESSCN2025/078527H01L 21/228SUZHOU LEKIN SEMICONDUCTOR CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236841WET TREATMENT DEVICECN2025/082738H01L 21/67CHANGZHOU S.C EXACT EQUIPMENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236943SEED LAYER PRETREATMENT DEVICE AND METHOD, AND SUBSTRATE TREATMENT APPARATUSCN2025/088252H01L 21/67ACM RESEARCH (SHANGHAI) , INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/236968CHIP PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD FOR CHIP PACKAGING STRUCTURECN2025/089152H01L 23/528HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237101WAFER CASSETTE SWITCHING METHOD AND RELATED DEVICECN2025/092800H01L 21/677BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237105CLAMPING MECHANISM, BEARING ASSEMBLY AND WAFER CLEANING APPARATUSCN2025/092851H01L 21/687BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237163HYBRID BONDING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFORCN2025/093604H01L 21/56SJ SEMICONDUCTOR (JIANGYIN) CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237227DISPLAY PANEL AND DISPLAY DEVICECN2025/094213H01L 23/60BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237249XYθ POSITIONING DEVICE AND CONTROL METHOD THEREFORCN2025/094359H01L 21/68YINGUAN SEMICONDUCTOR TECHNOLOGY CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237508METHOD FOR MANUFACTURING AN AVALANCHE PHOTODETECTOREP2024/063140H01L 31/18HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237527POWER DEVICE WITH PASSIVATION INTERFACEEP2024/063494H01L 29/06HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237528POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE POWER SEMICONDUCTOR MODULEEP2024/063542H01L 23/34HITACHI ENERGY LTDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237587SILVER COATED COPPER RIBBONEP2025/059405H01L 23/00HERAEUS ELECTRONICS GMBH & CO. KGELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237588SILVER COATED COPPER WIREEP2025/059406H01L 23/00HERAEUS ELECTRONICS GMBH & CO. KGELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237747SYSTEM CONSISTING OF A HEAT SINK ELEMENT AND DISTRIBUTION STRUCTURE, AND HEAT SINK ELEMENT AND DISTRIBUTION STRUCTURE FOR SUCH A SYSTEMEP2025/062405H01L 23/473ROGERS GERMANY GMBHELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237866MANUFACTURING METHOD OF CURED FILM, CURED FILM, ELECTRONIC ELEMENT, AND MANUFACTURING METHOD OF ELECTRONIC ELEMENTEP2025/062831H01L 21/02MERCK PATENT GMBHELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/237903CONNECTED ASSEMBLY AND METHOD FOR PRODUCING A CONNECTED ASSEMBLYEP2025/062904H01L 21/50SCHOTT AGELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238402SUBSTRATE SUPPORT, PROCESSING APPARATUS, AND METHOD OF PROCESSING A SUBSTRATE IN A PROCESSING APPARATUSIB2024/054768H01L 21/687APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238444METAL FOAM THERMAL INTERFACE MATERIALSIB2025/053973H01L 21/48INTERNATIONAL BUSINESS MACHINES CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238469ZERO TRACK SKIP WITH IN-LINE VIA TO METAL LINE CONNECTIONIB2025/054659H01L 23/48INTERNATIONAL BUSINESS MACHINES CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238488METHOD FOR CONTROLLING A WET ETCHING PROCESSIB2025/054822H01L 21/67NEXGEN WAFER SYSTEMS PTE. LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238712LIGHT-RECEIVING ELEMENTJP2024/017815H01L 31/0232NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238715LIGHT-RECEIVING ELEMENTJP2024/017821H01L 31/0232NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238716LIGHT-RECEIVING ELEMENTJP2024/017822H01L 31/10NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238721METHOD FOR PREDICTING OCCURRENCE RATE OF CRACKING, METHOD FOR SELECTING RESIN MATERIAL, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENTJP2024/017831H01L 23/12RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238786MAGNETIC DEVICEJP2024/018134H01L 29/82SP-AITH LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238841SEMICONDUCTOR DEVICEJP2024/018322H01L 21/768NTT, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238863LASER PROCESSING DEVICEJP2024/018384H01L 21/301YAMAHA HATSUDOKI KABUSHIKI KAISHAELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238921HIGH-FREQUENCY MODULEJP2025/000497H01L 25/00MURATA MANUFACTURING CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/238994PLASMA PROCESSING DEVICE AND SUBSTRATE SUPPORTERJP2025/008770H01L 21/3065TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239031FILM FORMATION DEVICE, FILM FORMATION METHOD, AND ARTICLE MANUFACTURING METHODJP2025/011941H01L 21/027CANON KABUSHIKI KAISHAELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239042CLEANING WATER PRODUCTION DEVICE AND CLEANING WATER PRODUCTION METHODJP2025/013357H01L 21/304KURITA WATER INDUSTRIES LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239044BONDING STAGEJP2025/013472H01L 21/52SHINKAWA LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239053SIC COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAMEJP2025/013742H01L 21/02ROHM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239101LAMINATED STRUCTURE, LIGHT-EMITTING ELEMENT, AND SEMICONDUCTOR DEVICEJP2025/014866H01L 21/203JAPAN DISPLAY INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239105CLEANING AGENT FOR SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING CLEANED SEMICONDUCTOR SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICEJP2025/014904H01L 21/304FUJIFILM CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239202BONDING DEVICE AND BONDING METHODJP2025/016300H01L 21/60TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239203BONDING STATE INSPECTION DEVICE AND BONDING STATE INSPECTION METHODJP2025/016306H01L 21/02BONDTECH CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239204PLASMA PROCESSING DEVICEJP2025/016312H01L 21/683TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239219MODULEJP2025/016479H01L 23/12MURATA MANUFACTURING CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239220MODULEJP2025/016480H01L 25/00MURATA MANUFACTURING CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239235METHOD FOR FORMING n-TYPE SILICON GERMANIUM LAYERJP2025/016559H01L 21/208TOYO ALUMINIUM KABUSHIKI KAISHAELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239240SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODJP2025/016587H01L 21/304TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239266SUBSTRATE CLEANING METHOD, AND METHOD FOR MANUFACTURING MASK BLANKJP2025/016871H01L 21/304AGC INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239272SiC COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAMEJP2025/016961H01L 21/02ROHM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239357LASER MACHINING METHOD AND WAFER MANUFACTURING METHODJP2025/017400H01L 21/304DENSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239358METHOD FOR DIVIDING SUBSTRATEJP2025/017401H01L 21/304DENSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239531BATH FOR CHEMICAL ETCHINGKR2025/004214H01L 21/67YCCHEM CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239751HEAT DISSIPATION PLATE STRUCTURE AND POWER SEMICONDUCTOR ASSEMBLYKR2025/095309H01L 23/367LX SEMICON CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/239993DUAL INTERFACE SILICON STACKUS2025/019847H01L 23/532ADVANCED MICRO DEVICES, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240041PACKAGE INCLUDING SUBSTRATES, INTEGRATED DEVICES, AND HEAT SLUGUS2025/024209H01L 23/367QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240054METHOD OF IN SITU LEAK MONITORING IN FLUID CIRCUITSUS2025/024871H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240059MULTI-THICKNESS CHIP INTEGRATION INTO CAVITIES OF A HOST WAFER USING LATERAL DIELECTRIC MATERIALUS2025/025039H01L 21/56PSEUDOLITHIC, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240089SELECTIVE PERIODIC EDGE DEPOSITION AND ETCHUS2025/025746H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240098DEVICE PACKAGE HAVING A CAVITY WITH SLOPED SIDEWALLSUS2025/026266H01L 23/13SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240113STRESS DISTRIBUTION FOR WAFER WARPAGE CONTROLUS2025/026814H01L 23/00PSEMI CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240115PACKAGE COMPRISING A PASSIVE DEVICE WITH A FRONT SIDE PROTECTION LAYERUS2025/026839H01L 21/48QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240117THROUGH-SILICON VIA PITCH TRANSLATION FOR STACKED MEMORY DEVICESUS2025/026847H01L 23/538MICRON TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240127SUBSTRATE SUPPORT HEAT TRANSFER STRUCTURESUS2025/027221H01L 21/687APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240151ETCHING SILICON-CONTAINING MATERIAL AND SILICON-AND-GERMANIUM-CONTAINING MATERIALUS2025/027745H01L 21/3065APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240260HIGH BANDWIDTH MEMORY DEVICE BANDWIDTH SCALING AND ASSOCIATED SYSTEMS AND METHODSUS2025/028678H01L 25/065MICRON TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240280ELECTRICAL DISCHARGE MACHINING PROCESSING FOR SEMICONDUCTOR WORKPIECEUS2025/028815H01L 21/02WOLFSPEED, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240282LASER-BASED PROCESSING FOR SEMICONDUCTOR WAFERSUS2025/028817H01L 21/02WOLFSPEED, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240309RF PULSING ASSISTED LOW-K MATERIAL DEPOSITION WITH HIGH DENSITYUS2025/028874H01L 21/02APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240380PLASMA-ENHANCED SILICON NITRIDE DEPOSITIONUS2025/029014H01L 21/02APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240420DOPED TUNGSTEN CARBIDE LOW-K ETCH HARD MASKUS2025/029066H01L 21/311APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240441COMPUTER VISION FOR SUSCEPTOR LEVELING AND ALIGNMENTUS2025/029092H01L 21/68APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240458BOTTOM-UP GAP FILL USING NON-CONFORMAL POISONINGUS2025/029117H01L 21/32APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240530SYSTEMS AND METHODS FOR VENTING A RETICLE PODUS2025/029216H01L 21/673ENTEGRIS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240535DUAL FORCE LIFT AND GROUND PINS FOR ELECTROSTATIC CHUCK AND METHOD FOR USE THEREOFUS2025/029224H01L 21/683AXCELIS TECHNOLOGIES, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240563CHAMBER WITH ENHANCEMENT LINER AND METHODS FOR DOWNSTREAM RESIDUE MANAGEMENTUS2025/029279H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240564SELF-ALIGNED PATTERNING ON PACKAGE SUBSTRATEUS2025/029280H01L 23/00MICRON TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240677DEPOSITION FILM TUNING AND TEMPERATURE TUNING FOR ETCH UNIFORMITYUS2025/029460H01L 21/311APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202547WO/2025/240914METHOD AND APPARATUS FOR THERMAL PROCESSING USING PULSED RESISTANCE HEATINGUS2025/029846H01L 21/67PULSEFORGE, INC.ELECTRICITYالکتریسیتهدانش هسته ای